Semiconductor machinery manufacturer Applied Materials (NASDAQ:AMAT) announced in Q4 CY2025, but sales fell by 2.1% year on ...

Summary: Our AI Investor Podcast hosts, Eric Bleeker and Austin Smith, have been counting down 12 trends they believe AI ...

Continued innovation in advanced packaging opens a clearer path to the outcomes the industry prioritizes. By tightening the physical distance between compute, memory, and interconnect, chipmakers ...

Contrel Technology, an LCD equipment specialist, is increasing its deployment in MicroLED and advanced packaging, which is expected to yield results in 2025. Save my User ID and Password Some ...

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

LED equipment manufacturer FitTech is gearing up to begin contract production of CoWoS advanced packaging equipment in the fourth quarter of 2024. Save my User ID and Password Some subscribers prefer ...

Every Wednesday and Friday, TechNode’s Briefing newsletter delivers a roundup of the most important news in China tech, straight to your inbox. Sign up Traditionally, packaging has been considered a ...

Advanced packaging mechanisms play a vital role in reducing food waste and ensuring the maintenance of quality during storage. An incredible challenge faced by the food industry is the development of ...

The increasing challenges and rising cost of logic scaling, along with demands for an increasing number of features, are pushing more companies into advanced packaging. And while that opens up a slew ...

Jinman Han is President of Samsung Semiconductor, Inc. & leads the U.S. business, including Memory, Foundry, System LSI and LED. Almost every innovation introduced to the world has been touted as the ...

Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...