EDN

X-FAB Rolls Out Trench-Isolated SOI CMOS Process

To reduce die size by up to 40 percent, Erfurt, Germany-based analog/mixed-signal foundry X-FAB Semiconductor Foundries AG Tuesday announced XT06, its 0.6-micrometer silicon-on-insulator (SOI) CMOS ...
EDN

X-Fab Debuts 0.6-Micron CMOS Process

X-Fab Semiconductor Foundries AG is now offering its 0.6-micron CMOS process for high-voltage applications such as embedded non-volatile memory. The mixed-signal technology, for applications up to 40V ...
Semiconductor Engineering

Impact of CMOS Image Sensors Fabrication Processes On The Quality Of Smartphone Pictures

A technical paper titled “A Review of the Recent Developments in the Fabrication Processes of CMOS Image Sensors for Smartphones” was published by researchers at Texas A&M University. “CMOS Image ...
Tech Xplore on MSN

New chip-fabrication method creates 'twin' fingerprints for direct authentication

Just like each person has unique fingerprints, every CMOS chip has a distinctive "fingerprint" caused by tiny, random manufacturing variations. Engineers can leverage this unforgeable ID for ...
TechNewsWorld

Luxtera Delivers CMOS Photonics Technology

Fabless semiconductor company Luxtera announced today that it has solved the longstanding problem of building advanced photonic interfaces into mass-produced silicon chips. The company claimed that, ...
Electronics For You

Twin-Chip Fabrication For Electronics Security

Researchers at the Massachusetts Institute of Technology have unveiled a novel chip-fabrication technique that could reshape hardware-level security for electronic systems by enabling paired ...
ExtremeTech

IBM builds graphene chip that's 10,000 times faster, using standard CMOS processes

Engineers at IBM Research are claiming to have built the world's most advanced graphene-based computer chip, with performance that's 10,000 times better than previous graphene ICs. The key to the ...
Semiconductor Engineering

Process Variation Analysis Of Device Performance Using Virtual Fabrication — Methodology Demonstrated On A CMOS 14-nm FinFET Vehicle

A new methodology to assess the impact of fabrication inherent process variability on 14-nm fin field effect transistor (FinFET) device performance. August 18th, 2021 - By: Coventor A new methodology ...
Electronic Design

Surface-Micromachined CMOS Process Enhances IC Tire-Pressure Sensor

An innovative design by Motorola's Sensor Products Division in Tempe, Ariz., optimally integrates a surface-micromachined capacitive automotive tire-pressure sensor with a 0.8-µm CMOS double-metal, ...
Electronic Design

Philips Ramps 90-nm CMOS Products Into High-Volume

Philips ramped up three key 90-nm CMOS products into volume production at the Crolles2 Alliance wafer fab in Crolles, France. The products are baseband chips for highly integrated system-inapackage ...