AI agents capable of handling large portions of chip design and verification are less about convenience and more about ...

As demand grows for more powerful and efficient microelectronics systems, industry is turning to 3D integration—stacking chips on top of each other. This vertically layered architecture could allow ...

This is the world’s first AI-powered super agent from Cadence that autonomously creates and verifies designs from specifications and high-level descriptions ...

Cadence has now launched the ChipStack AI Super Agent, the world’s first agentic workflow for automating chip design and ...

HRL will present initial data from the project at the GOMACtech conference next week in Pasadena, Calif. HRL is directing the overall program, leading the system design, developing thermal isolation ...

Cadence today announced a transformative step forward in redefining how semiconductors are designed with the launch of the ChipStack™ AI Super Agent.