At the heart of advancing semiconductor chip technology lies a critical challenge: creating smaller, more efficient electronic components. This challenge is particularly evident in the field of ...
Say you wanted to create a chip in which a processor fabricated in 32-nm process rules would be combined with memory done on a 65-nm process and analog blocks fabricated at 180 nm. This leads you to ...
An assured supply chain protects what we build today and paves the way for what comes next. When we can prove that the ...
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Apple chipmaker TSMC has announced plans to produce highly advanced 1.6nm chips that could be destined for future generations of Apple silicon. TSMC yesterday unveiled a series of technologies, ...
Semiconductor manufacturer Xanoptix (Merrimack, NH) has developed a wafer-scale process for the 3-D stacking of silicon with either GaAs or InP to make compound semiconductors. The company's Hybrid ...
The Benefits Of Curvilinear Full-Chip Inverse Lithography Technology With Mask-Wafer Co-Optimization
A technical paper titled “Make the impossible possible: use variable-shaped beam mask writers and curvilinear full-chip inverse lithography technology for 193i contacts/vias with mask-wafer ...
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