Intel joins forces with SoftBank and its subsidiary SAImemory on next-gen ZAM: Z-angle memory with memory design driven by ...
Generic test and repair approaches to embedded memory have hit their limit. Smaller feature sizes, such as 130 nm and 90 nm, have made it possible to embed multiple megabits of memory into a single ...
AMD submitted a patent to the World Intellectual Property Organization (WIPO) for a groundbreaking new memory architecture that can significantly enhance the performance of the DDR5 standard. The ...
BEIJING, Dec. 26, 2024 /PRNewswire/ -- WiMi Hologram Cloud Inc. (WIMI) ("WiMi" or the "Company"), a leading global Hologram Augmented Reality ("AR") Technology provider, today announced the ...
Lam Research Corporation is a $17 billion wafer-fabrication equipment maker. They are simulating and designing next generation computer memory. Its products are used primarily in front-end wafer ...
As the global AI computing race intensifies, the primary constraint is shifting from GPU architecture to memory physics. HBM ...
For all their superhuman power, today’s AI models suffer from a surprisingly human flaw: They forget. Give an AI assistant a sprawling conversation, a multi-step reasoning task or a project spanning ...
CUPERTINO, Calif.--(BUSINESS WIRE)--Apple® today announced M3, M3 Pro, and M3 Max, three chips featuring groundbreaking technologies that deliver dramatically increased performance and unleash new ...
The Spectre and Meltdown vulnerabilities in 2018 exposed computer memory as an easy target for hackers to inject malicious code and steal data. The aftermath spurred the adoption of memory-safe chips ...
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