At-speed testing and delay defect analysis have become increasingly critical in ensuring the reliability and performance of modern integrated circuits. As circuit complexity grows alongside rapid ...

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...

The shift to multi-die assemblies is forcing changes in how chips are tested and inspected in order to achieve sufficient yield ramp or respond more quickly to yield excursions.

Today's systematic and more subtle random defects are not only decreasing yields, but are also increasing the number of test escapes, or defective parts per million (DPPM) shipped out. One of the ...

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Synopsys chose the International Test Conference to highlight two significant initiatives: defect-detection enhancements in TetraMAX ATPG through slack-based cell-aware test capability, and a new STAR ...