With continuous device scaling, process windows have become narrower and narrower due to smaller feature sizes and greater process step variability [1]. A key task during the R&D stage of ...

To extend 193-nm lithography to next-generation semiconductors, Round Rock, Texas-based photomask provider Toppan Photomasks Inc. and Grenoble, France-based technology R&D organization Electronics and ...

Many foreign exchange (forex) traders learning about technical analysis and how to apply it in their currency trading strategy might wonder what is a double-top chart pattern. This bearish chart ...

The chip industry is preparing for the next phase of extreme ultraviolet (EUV) lithography at 3nm and beyond, but the challenges and unknowns continue to pile up. In R&D, vendors are working on an ...

Applied Materials, Inc. (AMAT), a semiconductor equipment manufacturer (“semi cap”), announced Centura Sculpta last week. According to the company, this tool will help semiconductor manufacturers ...

DPT is a critical technique for ensuring printability of device and interconnect layers in 20-nm IC manufacturing. However, splitting layers into two masks can introduce timing variations as a ...

SAN JOSE, Calif., Feb. 26, 2024 (GLOBE NEWSWIRE) -- Today at the SPIE Advanced Lithography + Patterning conference, Applied Materials, Inc. introduced a portfolio of products and solutions designed to ...