As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

Ensuring the reliability of multi-die assemblies requires a variety of approaches to detect subsurface defects. Bonds and interconnects are especially problematic and require more inspection ...

While many articles have been written about cell testing in R&D labs or cell testing during manufacturing in the factory, let’s turn to the topic of cell testing for incoming inspection. This article ...