Micron Technology (NasdaqGS:MU) starts volume production of next generation HBM4 memory a quarter ahead of its prior timeline. The company reports that all of its 2026 HBM capacity is already sold out ...

Micron Technology is committing around $200b to expand memory chip manufacturing capacity, with major projects in New York, Idaho, and Japan. The company reports that its entire high bandwidth memory ...

Samsung ships HBM4 memory at 11.7Gbps speeds and claims an early industry lead ...

The speed of data transfer between memory and the CPU. Memory bandwidth is a critical performance factor in every computing device because the primary CPU processing is reading instructions and data ...

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

It could allow Sony’s next-generation console to better support more complex game worlds and higher-resolution textures.

AMD's next-generation 'Halo' APU seems likely to use bleeding-edge LPDDR6 memory for nearly double the bandwidth.

TL;DR: Samsung Electronics advances its next-gen HBM4E memory with 13Gbps per-pin speeds, delivering up to 3.25TB/sec bandwidth-over 2.5 times faster than HBM3E-and doubling power efficiency. Targeted ...

The global High Bandwidth Memory (HBM) market is experiencing explosive growth driven by AI demand. The industry is heavily investing in 3D-stacked memory architecture (TSV technology) and advanced ...

AI doesn't just need memory; it also needs massive storage capacity. Western Digital is a leader in developing advanced 3D ...

With doubled I/O interfaces and refined low voltage TSV design, HBM4 reshapes how memory stacks sustain throughput under data ...