JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.
JEDEC has published the official HBM4 (High Bandwidth Memory 4) specification under JESD238, a new memory standard aimed at keeping up with the rapidly growing requirements of AI workloads, ...
The debut of DeepSeek R1 sent ripples through the AI community, not just for its capabilities, but also for the sheer scale of its development. The 671-billion-parameter, open-source language model’s ...
SAIMEMORY—founded in December 2024, and officially launched in June 2025—is a joint venture between SoftBank, Intel, and the University of Tokyo.
Samsung starts mass production of HBM4 memory with up to 3.3 TB/s bandwidth, 40% better efficiency, and confirmed AI GPU ...
Samsung has officially announced its new HBM4 memory is one of the first to be 'commercially' shipped, ready for 13Gbps and ...
TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, has successfully developed a prototype of a large-capacity, high-bandwidth flash memory module essential for large-scale ...
Companies Sign Memorandum of Understanding to Establish HBF Memory Technology Specification MILPITAS, Calif.--(BUSINESS WIRE)-- Sandisk Corporation (SNDK) today announced it has signed a landmark ...
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