Physik Instrumente’s Parallel photonics alignment technology comprises a suite of advanced firmware-level algorithms integrated into the company’s highest-performance motion controllers for 6DOF ...
Researchers have now developed a new superior hardware platform for artificial intelligence accelerators using photonic integrated circuits on silicon chip. Co-packaged optics (CPO) technology can ...
Co-packaged optics (CPO) technology can integrate photonic integrated circuits (PICs) with electronic integrated circuits (EICs) like CPUs and GPUs on a single platform. This advanced technology has ...
With the OptiSurf ® product portfolio TRIOPTICS has many years of experience in non-contact measurement of center thicknesses of single lenses and plano optics as well as for measurement of air gaps ...
Copper interconnects cannot deliver the high-performance requirements of modern systems, especially with the rapid expansion of datacentre infrastructure. Co-Packaged Optics (CPO) offer an alternative ...
The newly introduced F50Se module delivers performance advantages through material innovation and upgraded fabrication processes. The FoV of AR display is fundamentally limited by the refractive index ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results