A SPICE model based on the BSIM3 core eliminates shortcomings in the existing level 1 and level 3 subcircuit models, enabling better simulation of trench-type power MOSFETs. An improved SPICE model ...
Although electromechanical relays have historically been the primary load switch in most applications, MOSFETs have been encroaching on the relay's territory in recent years as technology advances ...
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