System-in-package (SiP) technology is at the beginning of its revolution. Some see the SiP in the same way as a system on chip (SoC)—as an IC component with no simple path to further customization.

LONDON — Renesas has started using new tools that the company says can halve system-in-package (SiP) design time since they rely on a top-down (predictive) design approach in which key characteristics ...

The world's first SiP (System in Package) processed LoRa+MCU solution is presented today through the extraordinary collaboration between the world-leading Internet of Things solution providers Gemtek ...

MOUNTAIN VIEW, Calif., Nov 5, 2018/PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) and Advanced Micro Foundry (AMF) today announced that a new, production-ready process design kit (PDK) based on AMF's ...

A new product from Emerson Process Management is enabling steam in place (SIP) cycle time reductions of typically 20 per cent on fully monitored plant installations. A new product from Emerson Process ...