Smiths Interconnect, a leading provider of innovative solutions for critical semiconductor test applications, and a business of Smiths Group, is pleased to announce that its patented, state-of-the-art ...
TANAKA Kikinzoku Kogyo K.K. (Head office: Chuo-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), which develops industrial precious metal products as one of the core companies of TANAKA ...
Smiths Interconnect’s high-power burn-in socket is a specialized electromechanical interface designed to temporarily connect a semiconductor device (like a CPU, GPU, AI accelerator or high-power ...
Smiths Interconnect, a leading provider of innovative solutions for critical semiconductor test applications, today announced the launch of DaVinci Gen V, the latest flagship product in its DaVinci ...
As semiconductor devices continue to advance, the demand for reliable, high-performance test sockets has never been greater. Yet, traditional socket design validation methods—such as per-pin ...
This article is adapted from a presentation at TestConX, March 5-8, 2023, Mesa, AZ, by Vijayakumar Thangamariappan, Nidhi Agrawal, Jason Kim, Constantinos Xanthopoulos, Ira Leventhal, and Ken Butler, ...
Smiths Interconnect has created an IC test socket for high-speed testing of 350μm minimum pitch devices. Smiths Interconnect has created an IC test socket for high-speed testing of 350μm minimum pitch ...
During standardized chip fabrication, integrate circuit (IC) testing is conducted repeatedly to inspect the chips once they are manufactured. IC testing begins with wafer penetration before etched ...
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