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SIGen Enhances CMOS Performance by 3DIC Wafer Scale Stacking Using Proprietary NANOCLEAVE(TM) Layer Transfer Process

SiGen collaborates closely with its customers by using its Customer Specific Substrate (CSS) development approach to work on application specific products. CSS is one of the most effective approaches ...
WRIC

Silicon Genesis Broadens the Use of Layer Transfer Methods for Advanced CMOS Image Sensor Stacks

Figure1: Cross-section-TEM image of an active photodiode (PD) layer transferred to a model signal transfer device (labeled here as a "mount" device). Image taken before subsequent removal of cleave ...
WRBL

Silicon Genesis extends its NANOCLEAVE™ Layer Transfer Process for 3DIC Integration to Interconnect Network Layers

Figure 1. A model INL 8 layer metal network assembled from M1, M2, and M4 layers from a 32nm CMOS logic circuit. The INL is fabricated on a Si substrate by 32nm capable BEOL tool sets. The total ...
WDTN

SIGen Enhances CMOS Performance by 3DIC Wafer Scale Stacking Using Proprietary NANOCLEAVE(TM) Layer Transfer Process

SIGen Enhances CMOS Performance by 3DIC Wafer Scale Stacking Using Proprietary NANOCLEAVE (TM) Layer Transfer Process News provided by EIN Presswire Mar 02, 2023, 9:00 PM ET SiGen Extends Application ...