Emil Otto is aiming at joining steel, stainless steel, brass and copper objects below 450°C with three tin-based soft-soldering pastes. “The soldering and tinning pastes do not require zinc chloride, ...

Removing the use of stencils for applying solder paste seven years ago helped to put Gemini Tec on the path to sustained success and business growth, with PCBA production topping 100,000 units in 2015 ...

Molded for lead-free process requirements, Multicore LF328 is a halide-free, no-clean, lead-free solder paste suitable for high-volume, stencil-printing applications with chip-scale-package lead ...

SHENMAO Technology proudly presents its latest innovation, the PF719-P250A solder paste, specifically designed for AI substrate power management modules. This cutting-edge solder paste represents a ...

One of the most significant challenges in the electronics industry is the formation of voids in solder joints. Voiding typically occurs when flux or solvent in the paste becomes trapped in the joint, ...

Through-hole chips are slowly falling by the wayside, and if you want to build something with new parts you will be using surface mount components. This means spreading paste and throwing it in the ...