The Capital Region has become an epicenter for research and manufacturing of so-called 3D, or stackable, computer chips, a ...

In a few weeks, Intel will release Ivy Bridge, the first mass-produced 22nm parts, and more importantly the first to use 3D "tri-gate" FinFET transistors. These CPUs will be incredibly fast and use ...

Researchers can now fabricate a 3D chip with alternating layers of semiconducting material grown directly on top of each other. The method eliminates thick silicon substrates between the layers, ...

Yesterday it was the "roof tile" method of stacking memory chips, and today IBM and 3M have announced that they are teaming up to develop a silicon glue that can be used to form "towers" out of ...

(Nanowerk News) The electronics industry is approaching a limit to the number of transistors that can be packed onto the surface of a computer chip. So, chip manufacturers are looking to build up ...

The electronics industry is approaching a limit to the number of transistors that can be packed onto the surface of a computer chip. So, chip manufacturers are looking to build up rather than out.