Samsung is considering using Intel’s packaging and glass substrate technology to give its production line a boost. The tie-up between the firms might elevate their game and could finally outperform ...

Glass substrates are considered one of the key directions for advanced packaging development, especially showing significant potential in high-performance computing (HPC) and data center sectors.

TL;DR: Intel has restructured its glass substrate workforce, shifting from in-house development to off-the-shelf solutions, signaling a major strategic change under CEO Lip-Bu Tan. This move follows ...

Intel has unveiled a glass core substrate for future semiconductor advanced packaging. Expected to be ready for the end of the decade for both Intel and Intel Foundry customers, the company believes ...

Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million ...

Google may use Intel Foundry’s EMIB packaging for TPUv8e, boosting Intel’s AI chip ambitions and reshaping advanced ...

Intel has confirmed to South Korean media that it will proceed with its semiconductor glass substrate commercialization plans as originally outlined, dismissing reports of potential withdrawal amid ...

Nvidia has reserved the majority of TSMC’s most advanced packaging capacity. The lesser-known chipmaking step may become the next bottleneck for AI.