Gathering in Albany, New York, one of the nation’s rising semiconductor innovation hubs, industry leaders will explore glass substrates as a ...

Kyocera Corporation (President: Shiro Sakushima; "Kyocera") today announced that it is commercializing a new multilayer ceramic core substrate for advanced semiconductor packages, such as xPUs(1) and ...

A new development in chip packaging could change how AI processors are built, making them smaller, faster, and more stable in ...

Built from Kyocera’s proprietary Fine Ceramic materials, the substrate is engineered for high‑density wiring and exceptional ...

AXT sits in a niche part of the semiconductor supply chain tied to optical networking and data connectivity, where demand for ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

The Department of Commerce is investing up to $300 million to accelerate the development of technologies to boost the semiconductor industry. The department said Thursday the three entities receiving ...

BOSTON, MA, UNITED STATES, March 12, 2025 / EINPresswire.com / -- University Wafer, Inc., a leading supplier of semiconductor substrates and services, proudly announces the expansion of its extensive ...

A s part of the CHIPS for America program, the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, ...

As demand for artificial intelligence (AI) semiconductors continues to surge, the market for glass substrates, which are widely regarded as a critical material for next-generation advanced packaging, ...

A San Francisco startup has raised more than $100 million for technology that could upend the global semiconductor industry—if it proves out. Founded by a protégé of investor Peter Thiel, Substrate ...