Business Wire

Global Wafer Level Packaging Market Report 2023: Sector is Expected to Reach $13.2 Billion by 2028 at a CAGR of 18.36% - ResearchAndMarkets.com

DUBLIN--(BUSINESS WIRE)--The "Wafer Level Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028" report has been added to ResearchAndMarkets.com's offering.
Seeking Alpha

ACM Research Receives Orders for Wafer-Level Packaging Tools from U.S. Customer and R&D Center

FREMONT, Calif., Sept. 04, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACMR) (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level ...
Seeking Alpha

NVE outlines accelerated growth plans with in-house wafer-level chip scale packaging and 4% sequential revenue increase

CEO Daniel Baker reported a 4% sequential increase in revenue for the quarter, highlighting strong increases in distributor and nondefense sales, despite an expected decrease in defense sales. Baker ...
Digi Times

Samsung steps up fan-out wafer-level packaging deployment

Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...
Nasdaq

ACM Research Enters Fan-out Panel Level Packaging Market with Introduction of Ultra C vac-p Flux Cleaning Tool for Chiplets

FREMONT, Calif., July 29, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging ...
Optics

Redefining Wafer-Level Packaging Production with Heidelberg Instruments Flexible Direct Writing Technology

Heidelberg, Germany – Heidelberg Instruments, a global player in direct write technology and solution provider for the advanced packaging market, is transforming the semiconductor industry with its ...
TweakTown

Apple iPhone 18 with A20 chip could switch to wafer-level multi-chip module packaging

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...
Electronic Design

STMicroelectronics, STATS ChipPAC, And Infineon Join Forces On Wafer-Level-Packaging

Semiconductor makers STMicroelectronics and Infineon have teamed with 3D packaging provider STATS ChipPAC to jointly develop the next generation of embedded Wafer-Level Ball Grid Array (eWLB) ...
Digi Times

NEWS TAGGED WAFER-LEVEL PACKAGING

Advanced Chip Engineering (ACE), a wafer-level packaging and testing house which has investment from King Yuan Electronics Company (KYEC), suffered a fire on the second floor of a... STATS ChipPAC has ...
Fudzilla

TSMC gets fan-out (InFO) wafer-level packaging

All ready for 2016 TSMC is scheduled to move its integrated fan-out (InFO) wafer-level packaging technology to volume production in the second quarter of 2016. Apparently the fruity cargo cult… TSMC ...
Business Wire

Research and Markets: Global Wafer-level Packaging Equipment Market 2014-2018 with Applied Materials, Disco, EV Group, Tokyo Electron & Tokyo Seimitsu Dominating

DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/s9zs8w/global) has announced the addition of the "Global Wafer-level ...