Integration of JUMPtec modules creates the world’s most comprehensive portfolio of application-ready COM platforms SAN ...

The range-expansion centres around all-new DWe bundles, which are available in four-andfive-piece configurations. For the ...

Global computer on module market is poised for substantial growth over the forecast period of 2023-2030, with revenue estimated to rise from US$ 1,338.7 million in 2022 to US$ 2,147.5 million by 2030, ...

HFM FPGA Module Standard arrives with solderable and connector variants, aiming to cut board redesign time and vendor lock-in ...

A new class of compact compute module integrates heterogeneous processing with industrial-grade resilience, tackling ...

New Heights in Edge AI: Significantly Faster NPU and GPU Performance ...

Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications SAN ...

In a time when DDR5 kits can cost more than a graphics card, some builders are literally soldering their own memory sticks to ...

ASE Group's co-packaged optics (CPO) strategy is close to complete. In addition to launching advanced packaging solutions ...

Learn how to integrate Quantum-Safe HSMs with Model Context Protocol (MCP) to secure AI infrastructure against Shor's algorithm and context injection.

The SGET announced a paradigm shift in embedded design with the official release of the Open Harmonised FPGA Module (oHFM) specification.

Robots for specific blue collar tasks in difficult, repetitive and harsh environments are delivering value now in terms of quality, safety, cost and process efficiencies.