AI-driven innovative technology brand TECNO is set to unveil its groundbreaking Modular Magnetic Interconnection Technology at MWC 2026. This concept, embodied by TECNO Modular Phone, represents TECNO ...
Abstract: In the past decade, design of sparse planar arrays has increasingly become a focal point, driven by its superior performance in terms of degrees of freedom (DOFs) and anti-mutual-coupling ...
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