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SK Hynix likely to use ASMPT equipment for next-gen HBM3E production

SK hynix is reportedly likely to adopt Singapore’s ASMPT equipment for its cutting-edge fifth-generation high bandwidth ...
IEEE

Inverse Hybrid Bonding for D2D/D2W Heterogeneous Integration with 20 μm Pitch

Abstract: Interconnect technologies are critical to meet the electrical and thermal requirements for high-performance heterogeneous integration systems. This work presents inverse hybrid bonding (IHB) ...
Investopedia

What Is Options Trading? A Beginner's Overview

Learn the benefits and risks of options and how to start trading options Lucas Downey is the co-founder of MoneyFlows, and an Investopedia Academy instructor. Samantha (Sam) Silberstein, CFP®, CSLP®, ...
IEEE

A study on the rheological characterization and flow modeling of molded underfill (MUF) for optimized void elimination design

Abstract: The molded underfill (MUF) process has a lot of advantages compared with capillary underfill process in view of reduction of process, cycle time of process, material and equipment cost since ...